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Oct , 12 2026
In the production and packaging of semiconductors, PCBs, and IC chips, issues such as electrostatic discharge (ESD), dust contamination, and burrs during die-cutting have long plagued production yields. Conventional paper materials are prone to shedding dust and particles, while some plastic sheets are difficult to manage regarding static electricity and are liable to fray or tear during processin...
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Oct , 19 2026
For thermoformers producing food trays and containers, polypropylene (PP) is a popular choice—yet it often presents significant challenges, such as a narrow processing window, sheet sagging, uneven wall thickness, surface defects, and potential food safety risks stemming from raw material contamination or an unclean production environment. Poor sheet quality not only leads to higher scrap ra...
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