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Oct , 21 2024
In today's fast-paced and ever-evolving electronics industry, innovation drives progress. As electronics become more compact and efficient, so must the components that support them. One such critical component is the lead frame spacer. At FULLSTAR, we’re excited to introduce our latest innovation—PP Synthetic Paper for Lead Frame Spacers—designed to meet the highest industry standards while of...
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Oct , 12 2026
In the production and packaging of semiconductors, PCBs, and IC chips, issues such as electrostatic discharge (ESD), dust contamination, and burrs during die-cutting have long plagued production yields. Conventional paper materials are prone to shedding dust and particles, while some plastic sheets are difficult to manage regarding static electricity and are liable to fray or tear during processin...
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